surface Mount Technology
Surface Mount Technology is an extremely important aspect of our business at East End Assemblies INC. Nearly all jobs quoted require surface mount technology, often in combination with conventional through hole components.
Once the board is completed, it then goes through our rigorous testing and/or inspection phase (testing equipment to be provided by the customer). The result is a printed circuit board assembly that has been manufactured flawlessly according to the standards our customers dictate. We can handle the toughest jobs with our SMT equipment. We assemble as low as .0201 size passive components and .012 lead pitch devices. We can also place BGS’s and micro BGA’s. For this process we two AMISTAR PLACEPRO 5630 pick and place machines.
THROUGH-HOLE & MIXED TECHNOLOGY
East End Assemblies Inc. meets production needs for mixed and plated through-hole technology PCB printed circuit board assemblies. All production hardware is profiled to suit each individual configuration.
We utilize volume production methods to assemble your product as efficiently as possible. We perform 100% inspection and all appropriate ESD precautions are adhered to when handling hardware. Inspection and handling requirements are in accordance with; IPC-610D, Class 3.
wave Soldering
East End Assemblies Inc. uses only the highest quality proprietary solder in our assembly process. Wave solder services are available with our NU/ERA-C technical devices wave solder machine for all through-hole applications.
